IBM21S850 vs TLE6250GV33XUMA1 feature comparison

IBM21S850 IBM

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TLE6250GV33XUMA1 Infineon Technologies AG

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer End Of Life
Ihs Manufacturer IBM MICROELECTRONICS INFINEON TECHNOLOGIES AG
Part Package Code QFP SOIC
Package Description LFQFP, SOP,
Pin Count 80 8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G80 R-PDSO-G8
JESD-609 Code e0 e3
Length 12 mm 5 mm
Number of Functions 1 1
Number of Terminals 80 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP SOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.75 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type ETHERNET TRANSCEIVER CAN TRANSCEIVER
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Width 12 mm 4 mm
Base Number Matches 1 1
Samacsys Manufacturer Infineon
Moisture Sensitivity Level 3
Technology BICMOS

Compare IBM21S850 with alternatives

Compare TLE6250GV33XUMA1 with alternatives