I1790SYR vs I17210XYIR feature comparison

I1790SYR Winbond Electronics Corp

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I17210XYIR Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIE
Package Description SOP, DIE,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 X-XUUC-N
JESD-609 Code e3
Length 17.93 mm
Number of Functions 1 1
Number of Terminals 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 180 s 420 s
Seated Height-Max 2.64 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.52 mm
Base Number Matches 1 1

Compare I1790SYR with alternatives

Compare I17210XYIR with alternatives