I17210XYIR vs I17180XY01 feature comparison

I17210XYIR Winbond Electronics Corp

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I17180XY01 Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE DIE
Package Description DIE, DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code X-XUUC-N X-XUUC-N
Number of Functions 1 1
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 50 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 420 s 360 s
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 1 1

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Compare I17180XY01 with alternatives