HV5812P-G
vs
UCN5812AF
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ALLEGRO MICROSYSTEMS LLC
|
Package Description |
1.565 X 0.580 INCH, 0.250 INCH HEIGHT, 0.100 INCH PITCH, GREEN, PLASTIC, MS-011AB, DIP-28
|
DIP, DIP28,.6
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
8542.39.00.01
|
Factory Lead Time |
6 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Data Input Mode |
SERIAL
|
SERIAL
|
Interface IC Type |
VACUUM FLUORESCENT DISPLAY DRIVER
|
VACUUM FLUORESCENT DISPLAY DRIVER
|
JESD-30 Code |
R-PDIP-T28
|
R-PDIP-T28
|
JESD-609 Code |
e3
|
e0
|
Length |
37.4 mm
|
37.4 mm
|
Multiplexed Display Capability |
NO
|
NO
|
Number of Functions |
1
|
1
|
Number of Segments |
20
|
20
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
6.35 mm
|
6.35 mm
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Supply Voltage1-Max |
80 V
|
|
Supply Voltage1-Min |
20 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
BIMOS
|
Temperature Grade |
AUTOMOTIVE
|
OTHER
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
Supply Current-Max |
|
4.5 mA
|
Supply Voltage1-Nom |
|
60 V
|
fmax-Min |
|
3.3 MHz
|
|
|
|
Compare HV5812P-G with alternatives
Compare UCN5812AF with alternatives