HV56020T-V/KXX
vs
HV56022T-V/KNX
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VQFN-43
|
VQFN-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8541.29.00.95
|
| Factory Lead Time |
6 Weeks
|
10 Weeks, 4 Days
|
| Date Of Intro |
2020-03-23
|
2020-03-23
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Bandwidth (3dB)-Nom |
0.000124 MHz
|
0.000124 MHz
|
| Frequency Compensation |
YES
|
NO
|
| JESD-30 Code |
S-PQCC-N43
|
S-PQCC-N20
|
| Length |
7 mm
|
4 mm
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
43
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC43/48,.28SQ,20
|
LCC20,.16,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
TR
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Slew Rate-Min |
0.09 V/us
|
0.09 V/us
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Voltage Gain-Min |
72
|
72
|
| Width |
7 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
| Micropower |
|
NO
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|