HSP3824VI
vs
HFA3824AIV96
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
JESD-609 Code |
e0
|
e0
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
TQFP48,.35SQ
|
TQFP48,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
50 mA
|
0.035 mA
|
Supply Voltage-Nom |
5 V
|
3.5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
BASEBAND CIRCUIT
|
BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
2
|
1
|
|
|
|
Compare HSP3824VI with alternatives
Compare HFA3824AIV96 with alternatives