HN62444BP-10 vs MR27V452D-XXRP feature comparison

HN62444BP-10 Renesas Electronics Corporation

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MR27V452D-XXRP OKI Electric Industry Co Ltd

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP OKI ELECTRIC INDUSTRY CO LTD
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 80 ns
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52.8 mm 51.98 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Alternate Memory Width 8

Compare HN62444BP-10 with alternatives

Compare MR27V452D-XXRP with alternatives