HN62331AP-12
vs
MS311026-12PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOSEL-VITELIC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
120 ns
JESD-30 Code
R-PDIP-T32
R-PDIP-T32
Length
41.9 mm
41.91 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.334 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
2
Rohs Code
Additional Feature
AUTOMATIC POWER DOWN
JESD-609 Code
e0
Package Equivalence Code
DIP32,.6
Standby Current-Max
0.00003 A
Supply Current-Max
0.04 mA
Terminal Finish
TIN LEAD
Compare HN62331AP-12 with alternatives
Compare MS311026-12PC with alternatives