HN62318BF
vs
MX27C8000ATC-10
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HITACHI LTD
|
MACRONIX INTERNATIONAL CO LTD
|
| Part Package Code |
SOIC
|
TSOP1
|
| Package Description |
SOP,
|
TSOP1, TSSOP32,.8,20
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
150 ns
|
100 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| Length |
20.45 mm
|
18.4 mm
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
MASK ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX8
|
1MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSOP1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.05 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| I/O Type |
|
COMMON
|
| JESD-609 Code |
|
e0
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
TSSOP32,.8,20
|
| Standby Current-Max |
|
0.0001 A
|
| Supply Current-Max |
|
0.06 mA
|
| Terminal Finish |
|
TIN LEAD
|
| Width |
|
8 mm
|
|
|
|
Compare HN62318BF with alternatives
Compare MX27C8000ATC-10 with alternatives