HN62315BF-20
vs
KM23C4001BG-20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP32,.56
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
20.45 mm
20.47 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX8
512KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.05 mm
3 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
SOP32,.56
Standby Current-Max
0.06 A
Supply Current-Max
0.06 mA
Terminal Finish
TIN LEAD
Width
11.43 mm
Compare HN62315BF-20 with alternatives
Compare KM23C4001BG-20 with alternatives