HN27C101AP-12 vs WE128K8150CI feature comparison

HN27C101AP-12 Hitachi Ltd

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WE128K8150CI Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD MICROSEMI CORP
Part Package Code DIP DIP
Package Description DIP, DIP32,.6 HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 120 ns 150 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T32 R-CDIP-T32
JESD-609 Code e0 e4
Length 41.9 mm 42.8 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM EEPROM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.13 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.25 mm
Base Number Matches 2 3
Pbfree Code No
Programming Voltage 5 V
Write Cycle Time-Max (tWC) 10 ms

Compare HN27C101AP-12 with alternatives

Compare WE128K8150CI with alternatives