HMA510JC-45
vs
IDT7210L25F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
PLASTIC, LCC-68
|
QFF,
|
| Pin Count |
68
|
64
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED AT 1MHZ
|
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 40MHZ
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
22.22 MHz
|
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQCC-J68
|
S-CQFP-F64
|
| JESD-609 Code |
e0
|
e0
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
68
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Data Bus Width |
35
|
35
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QFF
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.286 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.2316 mm
|
22.86 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
| Base Number Matches |
1
|
2
|
| Length |
|
22.86 mm
|
| Supply Current-Max |
|
90 mA
|
|
|
|
Compare HMA510JC-45 with alternatives
Compare IDT7210L25F with alternatives