IDT7210L25F
vs
HMA510GM-55/883
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTERSIL CORP
|
| Part Package Code |
QFP
|
PGA
|
| Package Description |
QFF,
|
CERAMIC, PGA-68
|
| Pin Count |
64
|
68
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 40MHZ
|
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-CQFP-F64
|
S-CPGA-P68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
22.86 mm
|
29.465 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
64
|
68
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Data Bus Width |
35
|
35
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.286 mm
|
5.2 mm
|
| Supply Current-Max |
90 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
22.86 mm
|
29.465 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A001.A.2.C
|
| Clock Frequency-Max |
|
18.18 MHz
|
| Package Equivalence Code |
|
PGA68,11X11
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare IDT7210L25F with alternatives
Compare HMA510GM-55/883 with alternatives