HM62W8127HLJP-25 vs 8959812BXA feature comparison

HM62W8127HLJP-25 Hitachi Ltd

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8959812BXA Micross Components

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD AUSTIN SEMICONDUCTOR INC
Part Package Code SOJ DIP
Package Description 0.400 INCH, PLASTIC, SOJ-32 0.600 INCH, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code R-PDSO-J32 R-CDIP-T32
JESD-609 Code e0 e4
Length 20.71 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOJ DIP
Package Equivalence Code SOJ32,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.76 mm 4.34 mm
Standby Current-Max 0.00005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) PALLADIUM GOLD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 15.24 mm
Base Number Matches 2 1

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