HM511000AP-8
vs
MDM11000TMB-12
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
MOSAIC SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP18,.3
,
Pin Count
18
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
FAST PAGE
Access Time-Max
80 ns
120 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS REFRESH
RAS/CBR/HIDDEN REFRESH
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T18
R-CDIP-T18
JESD-609 Code
e0
Length
22.26 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FAST PAGE DRAM
FAST PAGE DRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1MX1
1MX1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Seated Height-Max
5.08 mm
Standby Current-Max
0.001 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Compare HM511000AP-8 with alternatives
Compare MDM11000TMB-12 with alternatives