MDM11000TMB-12
vs
MB81C1000-12LC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
APTA GROUP INC
FUJITSU LTD
Package Description
DIP, DIP18,.3
DIP, DIP18,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Time-Max
120 ns
120 ns
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-XDIP-T18
R-XDIP-T18
JESD-609 Code
e0
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FAST PAGE DRAM
FAST PAGE DRAM
Memory Width
1
1
Number of Terminals
18
18
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Temperature-Max
110 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1MX1
1MX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.001 A
0.00025 A
Supply Current-Max
0.05 mA
0.047 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Part Package Code
DIP
Pin Count
18