HM365788K-9:D
vs
KM6465ALP-25
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP,
|
DIP, DIP22,.3
|
Pin Count |
22
|
22
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
25 ns
|
JESD-30 Code |
R-PDIP-T22
|
R-PDIP-T22
|
Length |
26.165 mm
|
26.745 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
22
|
22
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
16KX4
|
16KX4
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.33 mm
|
5.08 mm
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
Additional Feature |
|
BATTERY BACKUP
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Number of Ports |
|
1
|
Output Characteristics |
|
3-STATE
|
Output Enable |
|
NO
|
Package Equivalence Code |
|
DIP22,.3
|
Standby Current-Max |
|
0.00005 A
|
Standby Voltage-Min |
|
2 V
|
Supply Current-Max |
|
0.1 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HM365788K-9:D with alternatives
Compare KM6465ALP-25 with alternatives