HM365788K-9:D
vs
IDT7188S30P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
not_compliant
Access Time-Max
35 ns
30 ns
JESD-30 Code
R-PDIP-T22
R-PDIP-T22
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Package Description
DIP, DIP22,.3
Pin Count
22
ECCN Code
EAR99
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e0
Length
26.797 mm
Package Equivalence Code
DIP22,.3
Seated Height-Max
4.191 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
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