HI1-303/883
vs
5962-9073103M2X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TEMIC SEMICONDUCTORS
Package Description
CERAMIC, DIP-14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Analog IC - Other Type
SPDT
SPST
JESD-30 Code
R-GDIP-T14
S-CQCC-N20
JESD-609 Code
e0
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
14
20
Off-state Isolation-Nom
40 dB
68 dB
On-state Resistance-Max (Ron)
50 Ω
35 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
YES
Switch-off Time-Max
250 ns
145 ns
Switch-on Time-Max
300 ns
175 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
Base Number Matches
3
2
Screening Level
MIL-STD-883
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