HI1-0306-2
vs
JM38510/11607BCC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
VISHAY SILICONIX
Package Description
DIP-14
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
DPST
DPST
JESD-30 Code
R-GDIP-T14
R-CDIP-T14
JESD-609 Code
e0
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NO
Number of Channels
2
2
Number of Functions
2
2
Number of Terminals
14
14
Off-state Isolation-Nom
60 dB
62 dB
On-state Resistance-Max (Ron)
50 Ω
50 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output
SEPARATE OUTPUT
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
0.1 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
150 ns
150 ns
Switch-on Time-Max
250 ns
250 ns
Switching
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
14
Length
18.545 mm
Screening Level
MIL-M-38510
Seated Height-Max
4.45 mm
Width
7.62 mm
Compare HI1-0306-2 with alternatives
Compare JM38510/11607BCC with alternatives