HI1-0306-2
vs
DG306BDJ-E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTERSIL CORP
VISHAY SILICONIX
Package Description
DIP-14
DIP, DIP14,.3
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
DPST
DPST
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e3
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Normal Position
NO
NO
Number of Functions
2
2
Number of Terminals
14
14
On-state Resistance-Max (Ron)
75 Ω
50 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-on Time-Max
250 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Pbfree Code
Part Package Code
DIP
Pin Count
14
Length
18.285 mm
Moisture Sensitivity Level
1
Number of Channels
1
Off-state Isolation-Nom
62 dB
Peak Reflow Temperature (Cel)
260
Seated Height-Max
5.08 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
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