HEF4515BDB
vs
7703201JA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Package Description
DIP,
DIP, DIP24,.6
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
4-LINE TO 16-LINE DECODER
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
550 ns
1650 ns
Qualification Status
Not Qualified
Qualified
Seated Height-Max
5.84 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
3
Rohs Code
Part Package Code
DIP
Pin Count
24
Length
31.75 mm
Max I(ol)
0.0015 A
Number of Bits
16
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
3 mA
Prop. Delay@Nom-Sup
1650 ns
Screening Level
MIL-STD-883
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HEF4515BDB with alternatives
Compare 7703201JA with alternatives