HEF4093BP,652
vs
MC14023BCPD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e4
e0
Length
19.025 mm
18.86 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
3
Number of Inputs
2
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
BULK
Prop. Delay@Nom-Sup
185 ns
Propagation Delay (tpd)
185 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
4.2 mm
4.69 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Compare HEF4093BP,652 with alternatives
Compare MC14023BCPD with alternatives