HEF4067BP,652
vs
MC14067BCL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.6
DIP, DIP24,.6
Pin Count
24
24
Manufacturer Package Code
SOT101-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-PDIP-T24
R-CDIP-T24
JESD-609 Code
e3
e0
Length
31.7 mm
32.005 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels
16
16
Number of Functions
1
1
Number of Terminals
24
24
Off-state Isolation-Nom
50 dB
40 dB
On-state Resistance Match-Nom
5 Ω
10 Ω
On-state Resistance-Max (Ron)
175 Ω
280 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
5.59 mm
Supply Current-Max (Isup)
0.6 mA
0.6 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
340 ns
190 ns
Switch-on Time-Max
100 ns
190 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin (Sn)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
1
3
Signal Current-Max
0.025 A
Compare HEF4067BP,652 with alternatives
Compare MC14067BCL with alternatives