HD74LS30P
vs
JM38510/30009SDX
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HITACHI LTD
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP14,.3
|
DFP,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDFP-F14
|
| Length |
19.2 mm
|
9.21 mm
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.008 A
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
1.1 mA
|
|
| Prop. Delay@Nom-Sup |
20 ns
|
|
| Propagation Delay (tpd) |
20 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
5.06 mm
|
2.03 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
6.285 mm
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-M-38510 Class S
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HD74LS30P with alternatives
Compare JM38510/30009SDX with alternatives