HD74HC377RP vs 74HC273BQ,115 feature comparison

HD74HC377RP Renesas Electronics Corporation

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74HC273BQ,115 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP NXP SEMICONDUCTORS
Part Package Code SOIC QFN
Package Description SOP, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PQCC-N20
Length 12.8 mm 4.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 175 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.5 mm 2.5 mm
Base Number Matches 2 2
Manufacturer Package Code SOT764-1
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish NICKEL PALLADIUM GOLD
fmax-Min 24 MHz

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Compare 74HC273BQ,115 with alternatives