Findchips: Compare 74HC273BQ,115 vs 74HC273D/T3

74HC273BQ,115 vs 74HC273D/T3 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	QFN	SOIC
Package Description	2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20	SOP,
Pin Count	20	20
Manufacturer Package Code	SOT764-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PQCC-N20	R-PDSO-G20
JESD-609 Code	e4	e4
Length	4.5 mm	12.8 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	1	1
Number of Bits	8	8
Number of Functions	1	1
Number of Terminals	20	20
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Propagation Delay (tpd)	225 ns	225 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	2.65 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	NO LEAD	GULL WING
Terminal Pitch	0.5 mm	1.27 mm
Terminal Position	QUAD	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	2.5 mm	7.5 mm
fmax-Min	24 MHz	24 MHz
Base Number Matches	2	1
Pbfree Code		Yes
	Logic » FF/Latches	Logic » FF/Latches