74HC273BQ,115
vs
74HC273D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
QFN
Package Description
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20
Pin Count
20
Manufacturer Package Code
SOT764-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
JESD-609 Code
e4
e4
Length
4.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
8
Number of Functions
1
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
2.5 mm
fmax-Min
24 MHz
Base Number Matches
2
4
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
24000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
SOP20,.4
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