HD74HC257FPEL vs 74HC257PW,112 feature comparison

HD74HC257FPEL Renesas Electronics Corporation

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74HC257PW,112 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NEXPERIA
Part Package Code SOIC TSSOP
Package Description SOP, SOP16,.3 TSSOP-16
Pin Count 16 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 145 ns 165 ns
Qualification Status Not Qualified
Seated Height-Max 2.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 5.5 mm 4.4 mm
Base Number Matches 3 1
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
Date Of Intro 2017-02-01
Samacsys Manufacturer Nexperia
JESD-609 Code e4
Terminal Finish NICKEL PALLADIUM GOLD

Compare HD74HC257FPEL with alternatives

Compare 74HC257PW,112 with alternatives