HD74HC257FPEL
vs
74HC257DB,112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP1
Package Description
SOP, SOP16,.3
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count
16
16
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.06 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Equivalence Code
SOP16,.3
SSOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
TUBE
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
29 ns
33 ns
Propagation Delay (tpd)
145 ns
165 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
30
Width
5.5 mm
5.3 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT338-1
JESD-609 Code
e4
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Compare HD74HC257FPEL with alternatives
Compare 74HC257DB,112 with alternatives