Part Details for 74HC1G08GW,125 by NXP Semiconductors
Overview of 74HC1G08GW,125 by NXP Semiconductors
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Part Details for 74HC1G08GW,125
74HC1G08GW,125 CAD Models
74HC1G08GW,125 Part Data Attributes
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74HC1G08GW,125
NXP Semiconductors
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74HC1G08GW,125
NXP Semiconductors
74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TSSOP | |
| Package Description | PLASTIC, SC-88A, 5 PIN | |
| Pin Count | 5 | |
| Manufacturer Package Code | SOT353-1 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Family | HC/UH | |
| JESD-30 Code | R-PDSO-G5 | |
| JESD-609 Code | e3 | |
| Length | 2 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | AND GATE | |
| Max I(ol) | 0.002 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Inputs | 2 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP5/6,.08 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 27 ns | |
| Propagation Delay (tpd) | 135 ns | |
| Qualification Status | Not Qualified | |
| Schmitt Trigger | NO | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 6 V | |
| Supply Voltage-Min (Vsup) | 2 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1.25 mm |