HD74HC153T
vs
TC74AC157FS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TOSHIBA CORP
Part Package Code
TSSOP
SOIC
Package Description
TSSOP,
0.225 INCH, PLASTIC, SSOP-16
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
HC/UH
AC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Propagation Delay (tpd)
40 ns
16.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.6 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
2
1
Rohs Code
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74HC153T with alternatives
Compare TC74AC157FS with alternatives