HD74HC153T vs HD74HC257FP feature comparison

HD74HC153T Renesas Electronics Corporation

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HD74HC257FP Renesas Electronics Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 10.06 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 40 ns 145 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.5 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code SOP16,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Time@Peak Reflow Temperature-Max (s) 20

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