HD74ALVC1G80VSE
vs
HD74ALVC1G80VS-E
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HITACHI LTD
|
Part Package Code |
SON
|
SON
|
Package Description |
VSOF, FL6,.047,20
|
VSOF, FL6,.047,20
|
Pin Count |
5
|
5
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
JESD-30 Code |
R-PDSO-F5
|
R-PDSO-F5
|
JESD-609 Code |
e0
|
|
Length |
1.6 mm
|
1.6 mm
|
Load Capacitance (CL) |
30 pF
|
30 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
200000000 Hz
|
200000000 Hz
|
Max I(ol) |
0.024 A
|
0.024 A
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSOF
|
VSOF
|
Package Equivalence Code |
FL6,.047,20
|
FL6,.047,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Prop. Delay@Nom-Sup |
3 ns
|
3 ns
|
Propagation Delay (tpd) |
8 ns
|
8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
1.2 mm
|
1.2 mm
|
fmax-Min |
200 MHz
|
200 MHz
|
Base Number Matches |
1
|
2
|
|
|
|
Compare HD74ALVC1G80VSE with alternatives
Compare HD74ALVC1G80VS-E with alternatives