HD74ALVC1G80VS-E
vs
IDT74ALVC1G79DY
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HITACHI LTD
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SON
|
SOIC
|
| Package Description |
VSOF, FL6,.047,20
|
TSSOP, TSSOP6,.08
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PDSO-F5
|
R-PDSO-G5
|
| Length |
1.6 mm
|
2 mm
|
| Load Capacitance (CL) |
30 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
200000000 Hz
|
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSOF
|
TSSOP
|
| Package Equivalence Code |
FL6,.047,20
|
TSSOP6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
3 ns
|
3.8 ns
|
| Propagation Delay (tpd) |
8 ns
|
6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
1.2 mm
|
1.25 mm
|
| fmax-Min |
200 MHz
|
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD74ALVC1G80VS-E with alternatives
Compare IDT74ALVC1G79DY with alternatives