IDT74ALVC1G79DY
vs
HD74ALVC1G79VSE-E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
TSSOP, TSSOP6,.08
|
VSOF,
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-F5
|
| JESD-609 Code |
e0
|
e6
|
| Length |
2 mm
|
1.6 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VSOF
|
| Package Equivalence Code |
TSSOP6,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Prop. Delay@Nom-Sup |
3.8 ns
|
|
| Propagation Delay (tpd) |
6 ns
|
8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN BISMUTH
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
1.25 mm
|
1.2 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
1
|
| fmax-Min |
|
200 MHz
|
|
|
|
Compare IDT74ALVC1G79DY with alternatives
Compare HD74ALVC1G79VSE-E with alternatives