HD64180ZF-4
vs
UPD70216GF-8-3B9
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HITACHI LTD
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP,
|
14 X 20 MM, PLASTIC, QFP-80
|
| Pin Count |
80
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
20
|
| Bit Size |
8
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
8 MHz
|
16.13 MHz
|
| External Data Bus Width |
8
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
4
|
| Number of External Interrupts |
4
|
8
|
| Number of Serial I/Os |
3
|
1
|
| Number of Terminals |
80
|
80
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
2.9 mm
|
3 mm
|
| Speed |
4 MHz
|
8 MHz
|
| Supply Current-Max |
20 mA
|
90 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD64180ZF-4 with alternatives
Compare UPD70216GF-8-3B9 with alternatives