HD64180RP-8X
vs
8202102YX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
SHRINK, PLASTIC, DIP-64
|
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
19
|
23
|
| Bit Size |
8
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
|
| External Data Bus Width |
8
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PDIP-T64
|
R-CDIP-T64
|
| JESD-609 Code |
e0
|
|
| Length |
57.6 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
75 °C
|
110 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SDIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.778 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
19.05 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Supply Current-Max |
|
333 mA
|
|
|
|
Compare HD64180RP-8X with alternatives
Compare 8202102YX with alternatives