8202102YX
vs
MC68HC000IR12F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
23
|
23
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-CDIP-T64
|
R-PDIP-T64
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
110 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Speed |
8 MHz
|
16.67 MHz
|
| Supply Current-Max |
333 mA
|
50 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
9
|
2
|
| Package Description |
|
DIP,
|
| Clock Frequency-Max |
|
16.67 MHz
|
| Length |
|
81.535 mm
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
7
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| RAM (words) |
|
0
|
| Seated Height-Max |
|
5.84 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
22.86 mm
|
|
|
|
Compare 8202102YX with alternatives
Compare MC68HC000IR12F with alternatives