HD26LS32P
vs
DS26LS32MJ/883
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
CERAMIC, DIP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
EIA-422-A; EIA-423-A
|
EIA-422; EIA-423; FED STD 1020; FED STD 1030
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.2 mm
|
19.43 mm
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Low Current-Max |
0.008 A
|
0.008 A
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
25 ns
|
25 ns
|
| Receiver Number of Bits |
4
|
4
|
| Seated Height-Max |
5.06 mm
|
5.08 mm
|
| Supply Current-Max |
70 mA
|
70 mA
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| Differential Output |
|
NO
|
| Driver Number of Bits |
|
4
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
MIL-STD-883
|
| Technology |
|
TTL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare HD26LS32P with alternatives
Compare DS26LS32MJ/883 with alternatives