DS26LS32MJ/883 vs AM26LS32MF feature comparison

DS26LS32MJ/883 Rochester Electronics LLC

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AM26LS32MF NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description CERAMIC, DIP-16 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Driver Number of Bits 4
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-422; EIA-423; FED STD 1020; FED STD 1030 EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.43 mm 19.535 mm
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Low Current-Max 0.008 A
Output Polarity TRUE INVERTED
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 25 ns 25 ns
Receiver Number of Bits 4 4
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 70 mA 70 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 3 3

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