HD14077BFP vs HEF4077BT,652 feature comparison

HD14077BFP Hitachi Ltd

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HEF4077BT,652 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, PLASTIC, SOT-108-1, SO-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 8.65 mm
Logic IC Type XNOR GATE XNOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 350 ns 150 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.75 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 3.9 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT108-1
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 150 ns
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Technology CMOS
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare HD14077BFP with alternatives

Compare HEF4077BT,652 with alternatives