HD14050BFP vs M38510/05554BEX feature comparison

HD14050BFP Renesas Electronics Corporation

Buy Now Datasheet

M38510/05554BEX Intersil Corporation

Buy Now
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP HARRIS SEMICONDUCTOR
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 10.06 mm
Logic IC Type INVERTER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 160 ns 345 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm
Base Number Matches 1 1
Screening Level MIL-PRF-38535 Class B
Technology CMOS

Compare HD14050BFP with alternatives

Compare M38510/05554BEX with alternatives