HD100164FG vs 100371MW8 feature comparison

HD100164FG Hitachi Ltd

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100371MW8 National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD NATIONAL SEMICONDUCTOR CORP
Part Package Code QFP
Package Description QFF, DIE, DIE OR CHIP
Pin Count 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 100K 100K
JESD-30 Code S-GQFP-F24 R-XUUC-N24
Length 9.78 mm
Load Capacitance (CL) 3 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 3
Number of Inputs 16 4
Number of Outputs 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics OPEN-EMITTER
Output Polarity TRUE COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code QFF DIE
Package Equivalence Code QFL24,.4SQ DIE OR CHIP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK UNCASED CHIP
Power Supply Current-Max (ICC) 98 mA 80 mA
Propagation Delay (tpd) 3 ns 1.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.38 mm
Surface Mount YES YES
Technology ECL ECL
Temperature Grade OTHER MILITARY
Terminal Form FLAT NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD UPPER
Width 9.78 mm
Base Number Matches 1 3
Prop. Delay@Nom-Sup 2 ns
Screening Level 38535Q/M;38534H;883B

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