HD100164FG
vs
100371MW8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
NATIONAL SEMICONDUCTOR CORP
Part Package Code
QFP
Package Description
QFF,
DIE, DIE OR CHIP
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
100K
JESD-30 Code
S-GQFP-F24
R-XUUC-N24
Length
9.78 mm
Load Capacitance (CL)
3 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
3
Number of Inputs
16
4
Number of Outputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
QFF
DIE
Package Equivalence Code
QFL24,.4SQ
DIE OR CHIP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
UNCASED CHIP
Power Supply Current-Max (ICC)
98 mA
80 mA
Propagation Delay (tpd)
3 ns
1.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.38 mm
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
OTHER
MILITARY
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
UPPER
Width
9.78 mm
Base Number Matches
1
3
Prop. Delay@Nom-Sup
2 ns
Screening Level
38535Q/M;38534H;883B
Compare HD100164FG with alternatives
Compare 100371MW8 with alternatives