HCS370/P vs HCS370TI/ST feature comparison

HCS370/P Microchip Technology Inc

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HCS370TI/ST Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP TSSOP
Package Description 0.300 INCH, PLASTIC, DIP-14 4.40 MM, PLASTIC, TSSOP-14
Pin Count 14 14
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Factory Lead Time 15 Weeks
Samacsys Manufacturer Microchip
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e3 e3
Length 19.05 mm 5 mm
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 5.334 mm 1.2 mm
Supply Current-Max 5 mA 5 mA
Supply Voltage-Nom 3.5 V 3.5 V
Surface Mount NO YES
Telecom IC Type DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 2 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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