HCS370TI/ST
vs
HCS370-/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, TSSOP-14
PLASTIC, TSSOP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e3
e3
Length
5 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Current-Max
5 mA
Supply Voltage-Nom
3.5 V
3.5 V
Surface Mount
YES
YES
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
4.4 mm
Base Number Matches
1
1
Compare HCS370TI/ST with alternatives
Compare HCS370-/ST with alternatives