HCPL-7850#100
vs
HCPL-7800BOPTION300
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
BROADCOM INC
AVAGO TECHNOLOGIES INC
Package Description
DIP, SMDIP8,.3
SOP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
8 Weeks
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
0.1 MHz
85 MHz
Common Mode Voltage-Max
2.8 V
3750 V
JESD-30 Code
R-CDIP-T8
R-PDSO-G8
JESD-609 Code
e4
Length
9.655 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
100 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
SMDIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
HYBRID
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.4
8.15
Voltage Gain-Min
7.6
7.99
Width
7.62 mm
Base Number Matches
3
4
Part Package Code
SOIC
Pin Count
8
Isolation Voltage-Min
3750 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HCPL-7850#100 with alternatives
Compare HCPL-7800BOPTION300 with alternatives