HCPL-553K#200
vs
HCPL-553K#200
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
HEWLETT PACKARD CO
|
BROADCOM INC
|
Package Description |
HERMETIC SEALED, DIP-8
|
DIP-8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8541.40.80.00
|
8541.40.80.00
|
Additional Feature |
OPEN COLLECTOR, HIGH RELIABILITY
|
HIGH RELIABILITY
|
Configuration |
SEPARATE, 2 CHANNELS
|
COMPLEX
|
Current Transfer Ratio-Min |
9%
|
9%
|
Data Rate-Nom |
0.4 MBps
|
0.4 MBps
|
Forward Current-Max |
0.02 A
|
0.02 A
|
Forward Voltage-Max |
1.9 V
|
1.9 V
|
Hysteresis Ratio-Nom |
0.0125
|
0.0125
|
Isolation Voltage-Max |
1500 V
|
1500 V
|
JESD-609 Code |
e0
|
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Number of Elements |
2
|
2
|
Number of Functions |
2
|
2
|
On-State Current-Max |
0.008 A
|
0.008 A
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
Power Dissipation-Max |
0.05 W
|
0.05 W
|
Response Time-Max |
0.000006 s
|
0.000006 s
|
Supply Voltage-Min |
2 V
|
2 V
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HCPL-553K#200 with alternatives
Compare HCPL-553K#200 with alternatives