There are no models available for this part yet.
Overview of HCPL-553K#200 by Hewlett Packard Co
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for HCPL-553K#200 by Hewlett Packard Co
Part Data Attributes for HCPL-553K#200 by Hewlett Packard Co
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|---|---|
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Rohs Code
|
No
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Part Life Cycle Code
|
Transferred
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Ihs Manufacturer
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HEWLETT PACKARD CO
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Package Description
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HERMETIC SEALED, DIP-8
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Reach Compliance Code
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unknown
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ECCN Code
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3A001.A.2.C
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HTS Code
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8541.40.80.00
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Additional Feature
|
OPEN COLLECTOR, HIGH RELIABILITY
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Configuration
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SEPARATE, 2 CHANNELS
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Current Transfer Ratio-Min
|
9%
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Data Rate-Nom
|
0.4 MBps
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Forward Current-Max
|
0.02 A
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Forward Voltage-Max
|
1.9 V
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Hysteresis Ratio-Nom
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0.0125
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Isolation Voltage-Max
|
1500 V
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JESD-609 Code
|
e0
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Mounting Feature
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THROUGH HOLE MOUNT
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Number of Elements
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2
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Number of Functions
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2
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On-State Current-Max
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0.008 A
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Optoelectronic Device Type
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LOGIC IC OUTPUT OPTOCOUPLER
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Power Dissipation-Max
|
0.05 W
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Response Time-Max
|
0.000006 s
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Supply Voltage-Min
|
2 V
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Surface Mount
|
NO
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Terminal Finish
|
Tin/Lead (Sn/Pb)
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Alternate Parts for HCPL-553K#200
This table gives cross-reference parts and alternative options found for HCPL-553K#200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HCPL-553K#200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HCPL-553K#200 | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, CERAMIC, DIP-8 | Agilent Technologies Inc | HCPL-553K#200 vs HCPL-553K#200 |
| 5962-8767906KYX | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, CERAMIC, DIP-8 | Broadcom Limited | HCPL-553K#200 vs 5962-8767906KYX |
| 5962-8767906KYC | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, DIP-8 | Agilent Technologies Inc | HCPL-553K#200 vs 5962-8767906KYC |
| HCPL-553K | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, DIP-8 | Broadcom Limited | HCPL-553K#200 vs HCPL-553K |
| HCPL-553K#100 | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4Mbps, HERMETIC SEALED, CERAMIC, DIP-8 | Avago Technologies | HCPL-553K#200 vs HCPL-553K#100 |
| HCPL-553K#100 | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, DIP-8 | Hewlett Packard Co | HCPL-553K#200 vs HCPL-553K#100 |
| HCPL-553K#200 | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, DIP-8 | Broadcom Limited | HCPL-553K#200 vs HCPL-553K#200 |
| 5962-8767906KPA | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, CERAMIC, DIP-8 | Agilent Technologies Inc | HCPL-553K#200 vs 5962-8767906KPA |
| 5962-8767906KPA | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4Mbps, HERMETIC SEALED, CERAMIC, DIP-8 | Avago Technologies | HCPL-553K#200 vs 5962-8767906KPA |
| 5962-8767906KYX | Logic IC Output Optocoupler, 2-Element, 1500V Isolation, 0.4MBps, HERMETIC SEALED, CERAMIC, DIP-8 | Agilent Technologies Inc | HCPL-553K#200 vs 5962-8767906KYX |