GX1-200B-85-1.8
vs
MPC8240LZU200X
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
EBGA-352
|
LBGA,
|
Pin Count |
352
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
33 MHz
|
66 MHz
|
External Data Bus Width |
32
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
JESD-609 Code |
e0
|
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
352
|
352
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA352,26X26,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.65 mm
|
Speed |
200 MHz
|
200 MHz
|
Supply Voltage-Max |
1.89 V
|
2.625 V
|
Supply Voltage-Min |
1.71 V
|
2.375 V
|
Supply Voltage-Nom |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
4
|
Additional Feature |
|
ALSO REQUIRES 3.3V I/O SUPPLY
|
|
|
|
Compare GX1-200B-85-1.8 with alternatives
Compare MPC8240LZU200X with alternatives